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Business Goals
It is the goal of MIE to offer to the Printed Circuit Industry in Europe and now, throughout the world, those products
that are necessary to meet high-tech demands. MIE understands these demands to be:
- Higher layer counts in multilayers with constant and often thinner laminated thickness resulting in the use of thinner innerlayer cores.
- Finer line and space structures on both innerlayer and outerlayer images.
- Smaller via holes with high aspect ratio of board thickness to hole diameter.
- Smaller annular ring tolerances between holes and pads as well as between pads and solder mask clearances.
- Lower prices and gross margins in the Printed Circuit Board industry which forces producers toward more efficient methods,
standardization of complex processes, and quality assurance methods which reduce defects and the costs related to such defects.
- Small lot sizes and the need to reduce time between lots in every process.
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